- Total Cores
- 8
- Total Threads
- 16
- Max Turbo Frequency
- 5.00 GHz
- Intel® Turbo Boost Technology 2.0 Frequency‡
- 4.90 GHz
- Processor Base Frequency
- 3.40 GHz
- Cache
- 16 MB Intel® Smart Cache
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Workstation CPUStart with the supported platform
Intel Xeon W-1270 Processor CM8070104380910. Memory: DDR4-2933. Ask for current pricing and help choosing the right configuration.
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Start an order requestIntel / PRODUCT DETAILS
The full ordering code matters. Review socket support, firmware and thermal requirements before changing the processor.
Compare the recorded core count, clocks and cache against the workload.
View all specifications →Intel / ORDER & INSTALLATION DETAILS
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Distinguish a standalone component from an OEM processor or adapter kit.
Technical overview
Use the full part number when comparing options or asking about system fit.
| Memory | DDR4-2933 |
|---|---|
| Product collection | Intel® Xeon® W Processor |
| Processor number | W-1270 |
| Launch | Q2'20 |
| Codename | Comet Lake |
| Segment | Workstation |
| Ordering code | CM8070104380910 |
| PCI Express | 3.0; 16 lanes |
| Manufacturer | Intel |
| Model | Xeon W-1270 Processor |
| Manufacturer P/N | CM8070104380910 |
| Code Name | Products formerly Comet Lake |
| Vertical Segment | Workstation |
| Lithography | 14 nm |
| Recommended Customer Price | $398.00 |
| Total Cores | 8 |
| Total Threads | 16 |
| Max Turbo Frequency | 5.00 GHz |
| Intel® Turbo Boost Max Technology 3.0 Frequency ‡ | 5.00 GHz |
| Intel® Turbo Boost Technology 2.0 Frequency‡ | 4.90 GHz |
| Processor Base Frequency | 3.40 GHz |
| Cache | 16 MB Intel® Smart Cache |
| Bus Speed | 8 GT/s |
| TDP | 80 W |
| Marketing Status | Discontinued |
| Launch Date | Q2'20 |
| Embedded Options Available | No |
| Use Conditions | Workstation |
| Included Items | This product is available in tray and box. For boxed product, a thermal solution is included |
| Max Memory Size (dependent on memory type) | 128 GB |
| Memory Types | DDR4-2933 |
| Max # of Memory Channels | 2 |
| Max Memory Bandwidth | 45.8 GB/s |
| ECC Memory Supported ‡ | Yes |
| GPU Name‡ | Intel® UHD Graphics P630 |
| Graphics Base Frequency | 350 MHz |
| Graphics Max Dynamic Frequency | 1.20 GHz |
| Graphics Video Max Memory | 64 GB |
| 4K Support | Yes, at 60Hz |
| Max Resolution (HDMI)‡ | 4096x2160@30Hz |
| Max Resolution (DP)‡ | 4096x2304@60Hz |
| Max Resolution (eDP - Integrated Flat Panel)‡ | 4096x2304@60Hz |
| DirectX* Support | 12 |
| OpenGL* Support | 4.5 |
| Intel® Quick Sync Video | Yes |
| Intel® InTru™ 3D Technology | Yes |
| Intel® Clear Video HD Technology | Yes |
| Intel® Clear Video Technology | Yes |
| # of Displays Supported ‡ | 3 |
| Device ID | 0x9BC6 |
| Scalability | 1S Only |
| PCI Express Revision | 3.0 |
| PCI Express Configurations ‡ | Up to 1x16, 2x8, 1x8+2x4 |
| Max # of PCI Express Lanes | 16 |
| Sockets Supported | FCLGA1200 |
| Max CPU Configuration | 1 |
| Thermal Solution Specification | PCG 2015W |
| TJUNCTION | 100°C |
| Package Size | 37.5mm x 37.5mm |
| Intel® Optane™ Memory Supported ‡ | Yes |
| Intel® Thermal Velocity Boost | No |
| Intel® Turbo Boost Max Technology 3.0 ‡ | Yes |
| Intel® Turbo Boost Technology ‡ | 2.0 |
| Intel® Hyper-Threading Technology ‡ | Yes |
| Intel® Transactional Synchronization Extensions | No |
| Intel® 64 ‡ | Yes |
| Instruction Set | 64-bit |
| Instruction Set Extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
| Idle States | Yes |
| Enhanced Intel SpeedStep® Technology | Yes |
| Thermal Monitoring Technologies | Yes |
| Intel® Identity Protection Technology ‡ | Yes |
| Intel vPro® Eligibility ‡ | Intel vPro® Platform |
| Intel® Secure Key | Yes |
| Intel® AES New Instructions | Yes |
| Intel® Software Guard Extensions (Intel® SGX) | Yes with Intel® ME |
| Intel® OS Guard | Yes |
| Intel® Trusted Execution Technology ‡ | Yes |
| Execute Disable Bit ‡ | Yes |
| Intel® Boot Guard | Yes |
| Intel® Virtualization Technology (VT-x) ‡ | Yes |
| Intel® Virtualization Technology for Directed I/O (VT-d) ‡ | Yes |
| Intel® VT-x with Extended Page Tables (EPT) ‡ | Yes |
| Processor identity | Distinguishes the actual processor and supply scope. |
| Motherboard support | Board model, chipset and BIOS release |
| Build requirements | Memory type, cooling and intended expansion configuration |
| Cores | 8 |
| Turbo | 5.00 GHz |
| Base | 3.40 GHz |
| Intel® InTruTM 3D Technology | Yes |
| Intel® OptaneTM Memory Supported ‡ | Yes |
HOW THIS PRODUCT FITS YOUR SYSTEM
Choose how you plan to use this product.
Compare the recorded core count, clocks and cache against the workload.
Check the server support list and BIOS before ordering.
Use this checklist to describe the change. The host system and full configuration determine which parts will fit.
YOUR QUOTE REQUEST
Add the quantity, options and installation details you want us to quote.
Confirm the exact manufacturer part number, host compatibility and included components. Optional software is quoted separately only when requested.
SUPPORT & REPLACEMENT
Check support dates, replacement options and whether continued use still makes sense.
We do not have confirmed sales and support dates for this part number.
Send us the full CM8070104380910 order code, software release and support details before planning long-term use.
Ask us to check the current sales and support statusProducts with similar names or connectors may still be incompatible. Compare the full specifications, installed system and software requirements.
Compare related products These products may be related, but we have not confirmed them as replacements.USING HARDWARE RESPONSIBLY
Consider repairability, remaining support and actual operating demand. Extending service life is useful only when the equipment still meets your security and reliability requirements.
Use measured average input power for the same workload. PSU ratings and processor TDP are different from total system power.
Energy difference = (current W − proposed W) × hours × units ÷ 1,000. Excludes cooling, embodied emissions and purchase costs.CONNECTION DETAILS
This component works inside a compatible system. Verify the host generation and supported option list before choosing memory, processors or accelerators.
Browse the categories above for related equipment, then send us the full configuration so we can check the fit.
PRODUCT DETAILS
| Product Collection | Intel® Xeon® W Processor |
| Code Name | Products formerly Comet Lake |
| Vertical Segment | Workstation |
| Processor Number | W-1270 |
| Lithography | 14 nm |
| Total Cores | 8 |
| Total Threads | 16 |
| Max Turbo Frequency | 5.00 GHz |
| Intel® Turbo Boost Max Technology 3.0 Frequency ‡ | 5.00 GHz |
| Intel® Turbo Boost Technology 2.0 Frequency‡ | 4.90 GHz |
| Processor Base Frequency | 3.40 GHz |
| Cache | 16 MB Intel® Smart Cache |
| Bus Speed | 8 GT/s |
| TDP | 80 W |
| Marketing Status | Discontinued |
| Launch Date | Q2'20 |
| Embedded Options Available | No |
| Use Conditions | Workstation |
| Included Items | This product is available in tray and box. For boxed product, a thermal solution is included |
| Max Memory Size (dependent on memory type) | 128 GB |
| Memory Types | DDR4-2933 |
| Max # of Memory Channels | 2 |
| Max Memory Bandwidth | 45.8 GB/s |
| ECC Memory Supported ‡ | Yes |
| GPU Name‡ | Intel® UHD Graphics P630 |
| Graphics Base Frequency | 350 MHz |
| Graphics Max Dynamic Frequency | 1.20 GHz |
| Graphics Video Max Memory | 64 GB |
| 4K Support | Yes, at 60Hz |
| Max Resolution (HDMI)‡ | 4096x2160@30Hz |
| Max Resolution (DP)‡ | 4096x2304@60Hz |
| Max Resolution (eDP - Integrated Flat Panel)‡ | 4096x2304@60Hz |
| DirectX* Support | 12 |
| OpenGL* Support | 4.5 |
| Intel® Quick Sync Video | Yes |
| Intel® InTru™ 3D Technology | Yes |
| Intel® Clear Video HD Technology | Yes |
| Intel® Clear Video Technology | Yes |
| # of Displays Supported ‡ | 3 |
| Device ID | 0x9BC6 |
| Scalability | 1S Only |
| PCI Express Revision | 3.0 |
| PCI Express Configurations ‡ | Up to 1x16, 2x8, 1x8+2x4 |
| Max # of PCI Express Lanes | 16 |
| Sockets Supported | FCLGA1200 |
| Max CPU Configuration | 1 |
| Thermal Solution Specification | PCG 2015W |
| TJUNCTION | 100°C |
| Package Size | 37.5mm x 37.5mm |
| Intel® Optane™ Memory Supported ‡ | Yes |
| Intel® Thermal Velocity Boost | No |
| Intel® Turbo Boost Max Technology 3.0 ‡ | Yes |
| Intel® Turbo Boost Technology ‡ | 2.0 |
| Intel® Hyper-Threading Technology ‡ | Yes |
| Intel® Transactional Synchronization Extensions | No |
| Intel® 64 ‡ | Yes |
| Instruction Set | 64-bit |
| Instruction Set Extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
| Idle States | Yes |
| Enhanced Intel SpeedStep® Technology | Yes |
| Thermal Monitoring Technologies | Yes |
| Intel® Identity Protection Technology ‡ | Yes |
| Intel vPro® Eligibility ‡ | Intel vPro® Platform |
| Intel® Secure Key | Yes |
| Intel® AES New Instructions | Yes |
| Intel® Software Guard Extensions (Intel® SGX) | Yes with Intel® ME |
| Intel® OS Guard | Yes |
| Intel® Trusted Execution Technology ‡ | Yes |
| Execute Disable Bit ‡ | Yes |
| Intel® Boot Guard | Yes |
| Intel® Virtualization Technology (VT-x) ‡ | Yes |
| Intel® Virtualization Technology for Directed I/O (VT-d) ‡ | Yes |
| Intel® VT-x with Extended Page Tables (EPT) ‡ | Yes |
Specifications describe the processor, not a complete system. OEM memory limits, BIOS support, cooling, risers and power policy remain system-specific.
Processor model, ordering code and package markings serve different identification purposes.
Desktop and workstation processor
| Processor identity | Distinguishes the actual processor and supply scope. |
|---|---|
| Motherboard support | Board model, chipset and BIOS release |
| Build requirements | Memory type, cooling and intended expansion configuration |
Workstation processor
The complete processor number, ordering code and sSpec are separate controls. Socket compatibility alone does not prove support in an OEM server or workstation.
Prioritize certified workstation platforms, interactive frequency, memory capacity and GPU certification.
Measure renderer scaling, local cache, GPU participation and sustained thermal behavior.
Evaluate compile parallelism, memory footprint, storage throughput and software licensing.
Size PCIe lanes, system memory and professional GPUs as one validated workstation configuration.
Populate channels symmetrically and follow the OEM qualified-memory list; processor capability does not override platform limits.
Allocate lanes and physical slots across storage, networking and accelerators before selecting risers and backplanes.
Use the OEM-qualified heat sink, fan set, power supplies and inlet-temperature limits for the chosen chassis.
Send the server or workstation model, motherboard revision, quantity, destination, required condition and any exact sSpec requirement. The quotation will separate processor price, included hardware, warranty, freight, tax and lead time.
No. The socket is only one requirement. The OEM model, board revision, BIOS, cooling, processor power and supported CPU list must all approve Intel Xeon W-1270 Processor.
Use the complete processor name, Ordering Code and sSpec when a specific stepping is required. State whether you need a tray CPU, OEM option kit or spare kit.
It is a CPU-only catalog reference based on Intel's published customer price plus 20% when Intel provides one. Stock, condition, included thermal hardware, freight, tax and final validity are confirmed in writing.
No. Core count, frequency, cache, memory and accelerators are platform resources. Benchmark the actual server or workstation, software version, memory population and storage path.
01 / Application planning
Review processor support, BIOS, power and cooling with the intended system configuration.
Match the exact processor or option number and identify all required installation parts.
Include heatsinks, thermal materials, fans and platform enablement items where required.
02 / Inspection & testing
Agree the inspection and test scope for the offered condition before confirming the order.
03 / Packing & international delivery
Confirm the packing list, delivery address and receiving requirements before shipment.
Protect
Specify packing around the component, its sensitivity and the quantity ordered.
Prepare
Select packing suitable for the hardware, combined order and transport route.
Deliver
Confirm the destination and shipment scope before arranging collection.
Send the country, postal code, requested date and receiving restrictions with your enquiry. Packing, freight and delivery timing are confirmed in the written quotation.
Shipping guide ↗04 / Warranty & after-sales
Keep the warranty terms with the part number and supplied condition. The quotation or order defines the applicable coverage for your item.
Warranty & RMA guide ↗Include the product label, order reference and a description of the fault.
Provide the requested identification and diagnostic details.
Agree the authorized next step before shipping a return.
Repair, replacement or other remedies depend on the agreed warranty terms and the fault assessment.
Prepare the next step
Include quantities, destination, test evidence and warranty requirements.
Model selection & order planning
Intel Xeon W-1270 Processor CM8070104380910
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